Young Member Section Members | HKAE

Members

Ir Professor Pai ZHENG  
鄭湃

YMHKEng [2026]

Associate Professor, The Hong Kong Polytechnic University

Areas of expertise
Human-Robot Collaboration
Smart Product-Service Systems
Industrial Embodied Intelligence
Professional Qualification
  • Fellow, American Society of Mechanical Engineers (ASME), 2026-
  • Associate Member, The International Academy for Production Engineering (CIRP), 2024-
  • Senior Member, Institute of Electrical and Electronics Engineers (IEEE), 2022-
  • Senior Member, Chinese Mechanical Engineering Society (CMES), 2018-
Honours
  • High Cited Researchers (Engineering Track), Clarivate Web of Science, 2025
  • HKIE Outstanding Young Engineer of the Year, Hong Kong Institution of Engineers, 2025
  • SME Outstanding Young Manufacturing Engineer Award, Society of Manufacturing Engineers, 2024
  • NSFC Excellent Young Scientists Fund, National Natural Science Foundation of China, 2024
  • Endowed Young Scholar in Smart Robotics, The Hong Kong Polytechnic University, 2022-2030
Profile

Ir Prof Pai Zheng (F’ASME, SM’IEEE, M’SME/HKIE, AM’CIRP) is currently an Associate Professor, Wong Tit-Shing Endowed Young Scholar in Smart Robotics, and Director, National Centre of Technology Innovation for Intelligent Design and Numerical Control (NCDC) – Hong Kong Branch, in the Department of Industrial and Systems Engineering, at The Hong Kong Polytechnic University (PolyU). His research interests include human-robot collaboration, smart product-service systems, and industrial embodied intelligence. He serves as the Chair of IEEE Hong Kong Section SMC Chapter, Co-chair of IEEE TC on DMHCA, Scientific Committee Member of SME | NAMRI, Associate Editor of TASE, JMS, JIMS, JCLP, etc.

Education

PhD
Mechanical Engineering
The University of Auckland, New Zealand
Dec 2017

MEng
Mechanical Engineering
Beihang University, China
Jan 2013

BEng
Material Processing and Control Engineering (Major), Computer Science and Technology (Minor)
Huazhong University of Science and Technology, China
Jun 2010